Manufacturing High Current PCBs

requires advanced processes to handle heavy copper, typically ranging from 2oz to over 10oz. A key challenge is the precise etching of thick copper; manufacturers often utilize multi-step etching or horizontal plating technologies to maintain trace accuracy and minimize undercut. To ensure reliable interconnections in thick boards, high-aspect-ratio drilling and via filling with conductive epoxy are essential. Additionally, specialized surface finishes like heavy tin plating or busbar integration are applied to further enhance current-carrying capacity.